Samsung 8GB 1333MHz DDR3 PC3-10600 Registered ECC CL9 240-Pin DIMM Very Low Profile (VLP) Dual Rank Memory – M392B1K70CM0-CH904

Samsung 8GB DDR3-1333 VLP ECC Registered Memory Part# M392B1K70CM0-CH904

This Samsung 8GB memory module is genuine Samsung equipment. The part number is M392B1K70CM0-CH904. It uses a Very Low Profile design, known as VLP. This is the highest capacity VLP module in our catalog, doubling the 4GB VLP options. It runs at 1333MHz on the PC3-10600 standard.

This module has ECC Registered support and a dual-rank design. ECC catches and corrects memory errors before they crash your system. It carries a CL9 latency rating for steady performance. Every unit is tested and cleaned before it ships. It performs like new, fitting the same tight blade chassis as our smaller VLP modules.

Key Specifications

• Brand: Samsung

• Part Number: M392B1K70CM0-CH904

• Capacity: 8GB

• Speed: 1333MHz (PC3-10600)

• Memory Type: DDR3 ECC Registered (RDIMM)

• CAS Latency: CL9

• Rank: Dual Rank

• Pin Count: 240

• Form Factor: Very Low Profile (VLP)

• Condition: Refurbished, tested, and verified functional

Compatible Systems

Built for blade servers that call for Very Low Profile DDR3 memory at higher capacity. Many Dell PowerEdge M series and HP ProLiant BL series blades from this server generation support 8GB VLP modules. This helps where slot count is limited. Please check your exact model and its memory list before ordering. Blade chassis are strict about module height.

Why Choose This Memory Module

• Highest Capacity VLP Option: 8GB doubles the capacity of our 4GB VLP modules while keeping the same low profile fit.

• Very Low Profile Fit: Clears the tight internal space of 1U blade enclosures without any modification.

• Fewer Slots for the Same Total: Reaching a target memory size with fewer, higher capacity modules can simplify a blade build.

• Genuine Samsung Chips: Built from original Samsung dies, tested for full function before it ships.

Ideal For

Blade servers with limited memory slots that still need high total capacity, and data center chassis upgrading from smaller VLP modules.